|
Fall
2000
|
|
Date
|
Presenter(s)
|
Title
|
|
19Sep00
|
Michael
Walock
|
Thermal
Conductivity Measurements of Silicon Using a Thermally Bridged Solution
to the 3w Method
|
|
Description
|
| The
3w method for thermal property measurements was originally solved for bulk
samples of dielectrics. However, it has been extended to conductors and
semiconductors through the use of an electrically insulated dielectric
material. The thickness of this dielectric directly affects the frequencies
used to measure across the dielectric and into the substrate. |
|
